Power ICs and other high power devices, for example
LEDs, are generating more heat on highly integrated
circuit boards. The traditional epoxy-Fiber Glass substrate
shows poor thermal management capability and leads to
a result of less reliability and lower performance.
¡§T-Board¡¨,
the highly thermal conductive substrate with superior
characteristics can solve all your problems from system
overheat.
¡¨,
the highly thermal conductive substrate with superior
characteristics can solve all your problems from system
overheat.